Internal Bond Tester
Measures the internal bonding strength of paper and paper board
The unit causes a high speed rupture in the Z-direction of the test piece. The test results correlate with substrate failures that occur during printing and conversion.
The dynamic nature of the Internal Bond Test gives a much clear idea of how a substrate will resist the Z-directional forces (in many printing and converting processes) than the static tests done on Universal Testing Machines. Complies with Tappi T 569 Standard on Internal Bond Testing.
Used primarily to examine blistering of coated papers, picking, de-lamination of multiply materials and the effects of additives and beating at pulp stock preparation.
Microprocessor controlled and extensively re-engineered by Huygen to eliminates the errors previously inherent in analogue units. Delivers accurate, very repeatable results.
|AV-3 microprocessor displays the test results and statistics
|Solid stainless steel pendulum gives 0 – 347 x 10-3 ft.lbs/sq in or 0-729 J/sq m
|Pneumatic / hydraulic sample press with individual cylinders ensures equal and consistent clamping force on each specimen.
|Electronically controlled, user selectable pressing time.
|Magnetic pendulum release for positive positioning and repeatable drops
|Canted, heavy pedestal with improved bearings
|Push button, pneumatic sample clamping
|Clutched, gear-driven tape dispenser
|Calibration weight set and slide for regular calibration checks
- Dimensions: 61 (W) x 41 (D) x 56 cm (H)
- Nett Weight: 34kgs
- Case Dimensions: 74 x 48 x 66 cm
- Packed Weight: 37kg
For further information, please contact our sales team on 01223 492081 or via firstname.lastname@example.org